Garmo Power Semiconductor Compiler
Device-to-converter co-design across Si, SiC and GaN: topology, device, magnetics, gate-driver, thermal/reliability and control optimization.
Find the engineering responsibility. Then choose the exact release—not an ambiguous capability label.
73 matching program identities · registry 6.0.0
Device-to-converter co-design across Si, SiC and GaN: topology, device, magnetics, gate-driver, thermal/reliability and control optimization.
RFIC and heterogeneous RF-system compiler spanning circuit synthesis, S-parameters, noise, nonlinear analysis, EM-aware passives and calibration.
Antenna, array, feed, package material, coupling, beamforming and thermal co-design tied to RF circuitry.
Parametric MEMS/sensor design across structural, electrostatic, fluidic, acoustic, thermal and piezoelectric domains with readout/package co-design.
Cryo-CMOS control, waveform generation, ADC/DAC/readout, multiplexing, clock/reference and thermal-stage partitioning for quantum-control systems.
Workload-to-CIM mapping across SRAM/digital/analog/emerging-memory arrays with converters, calibration, nonideality and accuracy-in-loop evaluation.
Spiking/event-driven architecture mapping for neurons, synapses, event routers, temporal state, local memory and energy/event optimization.
eFPGA/CGRA/programmable-NoC fabric generation, mapping, routing, bitstreams, partial reconfiguration and post-silicon repair.
Typed declarative semiconductor product-intent language with grammar, AST, units, constraints, objectives, provenance and compilation into platform requests.
Electrical/protocol/mechanical/thermal/power/test/security/software/supply compatibility analysis and qualified chiplet composition/exchange metadata.
Finite-capacity semiconductor production scheduler spanning wafer starts, fab routes, mask slots, package/OSAT, HBM/substrate, ATE, inventory and contingencies.
Fleet telemetry, cohort analysis, aging/failure modeling, drift detection and feedback from deployed hardware into next-generation design.
Atomic/molecular process-chemistry engine for surface reactions, ALD/ALE/deposition/etch cycles, plasma chemistry and inverse chemistry design.
Crystal-growth and epitaxy design over composition, dopants, strain, lattice mismatch, defects, reactor fields, precursor flux and growth-front behavior.
UWBG material/device/heterostructure, field-plate, termination, dielectric, contact, package, breakdown, thermal and reliability co-design.
Single/entangled/squeezed photon-source, interferometer, detector, feed-forward, fidelity, loss and heralding-aware quantum photonic design.
chi2/chi3, resonator/waveguide, pump-signal-idler, frequency-comb, dispersion, phase-matching and conversion-efficiency design.
Perovskite/hybrid film, interface, defect, ion-migration, transistor/LED/photodetector/solar-cell and degradation modeling/design.
Radiation/particle detector materials, sensor volumes, pixels, scintillators, SiPM/APD/SPAD, charge collection, front-end conversion and event reconstruction.
Failure localization, physical/electrical evidence fusion, layer/device reconstruction, provenance and controlled reverse-engineering workflow.
Defect-state design and optimization across material/process/device defects, distributions, energetics, transport and reliability impact.
Closed atom/material/process/device/fab compilation path coordinating chemistry, epitaxy, defects, device physics, manufacturing and evidence.
Design/qualification framework for MRAM-class spintronic and emerging nonvolatile memories with device, array, peripheral, variation, endurance and system mapping.
Monolithic/sequential-3D architecture, tier, interconnect, thermal, process-order and cross-tier placement/route optimization.
Radiation and extreme-environment architecture/process hardening with mission profiles, fault models, mitigation and qualification evidence.
Superconducting digital logic architecture, timing, bias/power, cryogenic interconnect and model-aware mapping for supported process technologies.
Biointerface, microfluidic, sensing, stimulation/readout, material, package and safety co-design for lab-on-chip/bioelectronic systems.
Joint sensor/optics/readout/compute reconstruction co-design for computational cameras, spectral/depth/ToF and other imaging systems.
Energy-harvester, storage, power-management and workload co-design for intermittently powered and self-powered silicon.
Lifecycle carbon/material/water/energy/yield/cost optimization across process, package, supply and product lifetime.
Co-design of AI compute with sensing, actuation, physical dynamics, real-time constraints, safety and energy/thermal behavior.
Precision timing, clock/reference, synchronization, ranging and positioning/navigation/timing silicon architecture compiler.
Atomic/2D-material electronic device and circuit design with material, interface, contact, transport and process constraints.
Metasurface/flat-optics element, phase, material, field, fabrication and system co-design.
Display backplane/emitter/pixel/driver/power/thermal/optical architecture and process co-design.
Flexible/stretchable geometry, material, strain, interconnect, device, sensor and package design under mechanical deformation.
Acoustic/phononic resonator, waveguide, filter, transducer, field and material co-design.
Spin-wave/magnonic material, excitation, propagation, interference, routing and compute-device compiler.
Quantum-sensing device/control/readout architecture with sensitivity, coherence, calibration and environmental constraints.
III-V laser/modulator/detector/amplifier and heterogeneous active-optoelectronics design and integration.
Organic/molecular material, device, interface, transport, stability and circuit/system design.
Embedded microfluidic/cooling network, thermal field, flow, pumping, package and workload co-design.
Hybrid-bonding, die/chiplet/package physical, electrical, thermal, mechanical, test and manufacturing co-design.
Instrument-aware experiment planning/execution, calibration, measurement provenance and closed-loop semiconductor laboratory automation.
Measurement reconstruction, defect/feature extraction, uncertainty, correlation and model calibration from semiconductor metrology data.
Reticle/wafer-scale partitioning, routing, power, clock, repair, yield, test and workload mapping.
Fault-model-driven redundancy, repair, isolation, recovery, graceful degradation and qualification synthesis.
Measurement-to-compact-model and characterized PDK-view generation with fitting, corners, uncertainty and qualification.
Process-equipment state, chamber/tool behavior, recipe interaction, maintenance and manufacturing digital-twin modeling.
Package/chiplet assembly yield, known-good-die, bonding, test, binning, redundancy and cost optimization.
Executable standards/compliance/interoperability profiles, negative testing, version matrices and evidence management.
Evidence-grounded reusable architecture knowledge, tradeoff, failure, benchmark and design-decision system for autonomous engineering.
OPC, inverse lithography, source-mask optimization, multi-patterning, curvilinear support, DFM, mask-data prep and process-simulation interfaces.
Calibrated multi-fidelity cross-domain model hierarchy spanning design, process, package, manufacturing and measured silicon with uncertainty/sensitivity.
Closed-loop architecture/design candidate generation, legal transformation, evaluation ladders, evidence retention and next-generation optimization.
Joint electronic/photonic architecture, implementation, packaging, optical/electrical interfaces and system optimization.
Autonomous analog, RF and power circuit topology/parameter/layout optimization under authoritative models and evidence gates.
Evidence-aware migration across foundries/nodes/libraries/process options while preserving constraints, functionality and qualification boundaries.
Machine-verifiable proof/evidence objects bound to requirements, source, implementation, signoff, release and measured-silicon claims.
Wafer/process/test/yield ingestion, excursion/root-cause analysis, predictive yield and feedback to process/design optimization.
Workload-to-chiplet/package/board/rack compilation spanning compute, memory, network, power, cooling, reliability and economics.
Versioned provenance/attestation for material, process, wafer, die, package, test, firmware and custody through the semiconductor supply chain.
DFT insertion, ATPG/MBIST/test orchestration, diagnosis, repair, characterization and evidence management across silicon lifecycle.
Reusable semiconductor-IP generation, qualification, packaging, dependency, release and evidence automation.
Memory architecture/compiler layer spanning arrays, banking, ECC/BISR, timing/power views, wrappers, physical integration and qualification.
Threat-model-driven root-of-trust, secure boot, identity, lifecycle, debug, attestation, isolation, information-flow and attack-test integration.
Chip/package/board/rack PDN, regulator, decoupling, IR/EM, transient, power-state and thermal-aware power-delivery co-design.
Executable whole-system virtual silicon for firmware/software/workload bring-up, performance/correctness modeling and evidence before fabrication.
Joint compiler, ISA, accelerator, memory, schedule, mapping and physical-cost optimization with measurable workload feedback.
Search and optimization across device structures, process steps, materials, constraints and manufacturability with authoritative physics/evidence boundaries.
Material/property/data/model exploration and candidate ranking with provenance, uncertainty and process/device integration.
Cost, yield, wafer/package/test, capacity, schedule, pricing, licensing and business-case modeling tied to engineering configuration.
Unified control plane from invention and patent/trade-secret state through canonical IP, source/dependencies, qualification, physical releases, licensing/royalties, customer delivery, errata and lifecycle evidence.
These existing Garmo products keep their own identity, packaging and evidence.
Fail-closed semiconductor evidence assurance product with provenance/hash binding, clock/EM/fallback/physical gates, deterministic ledger, signing and conservative adapters.
Review the release ↗Content-addressed artifact/release vault with deterministic sealing, release events, signature verification and controlled export.
Review the release ↗Hash-bound registry and compatibility engine for PDK, deck, library, model and approved-stack identity without redistributing protected PDK payloads.
Review the release ↗Stable-identity graph linking products, requirements, RTL, implementations, process artifacts, evidence and lifecycle state through typed provenance/dependency edges.
Review the release ↗Generator and reference soft-IP kit providing GFI-style management, streaming boundary, reset/isolation, firmware header, constraints and qualification package for customer payloads.
Review the release ↗Deterministic binary-linear optimization runtime with branch-and-bound, propagation, independently checkable solution certificate and native-core plugin boundary.
Review the release ↗Payload-to-standardized-IP package generator producing deterministic register map, SV shell, C header, manifest, verification checklist and CI contract.
Review the release ↗Controlled engineering orchestrator using allowlisted actions, immutable audit records, evidence-gated state transitions and bounded repair rules.
Review the release ↗Deterministic legal-profile optimizer over supplied lane/rate/modulation/FEC/EQ capabilities, service constraints, scoring and fallback generation.
Review the release ↗Point-tool product suite with CPU qualification oracles and GPU/CUDA-capable kernels/interfaces for placement, routing, fault simulation and combinational equivalence.
Review the release ↗