FPP - First-Principles Packaging Platform
Signal, power, thermal/fluidic, mechanical and test/management fabrics under one compiler/evidence model
Architecture IPRelated canonical identities, organized together. A shared family is not a claim that every release is mutually compatible or equally qualified.
Signal, power, thermal/fluidic, mechanical and test/management fabrics under one compiler/evidence model
Architecture IPHierarchical active/passive bridging for local and global package interconnect.
Architecture IPMechanical architecture addressing package expansion and warpage within FPP.
Architecture IPCo-optimizes electrical, power, thermal, mechanical, yield, test and cost constraints
Architecture IPCompute/memory/I/O/power/fabric/management pod + local bridge/RDL + power/thermal/mechanical interfaces
Architecture IPPower-delivery architecture for the FPP multi-physics package platform.
Architecture IPPackage-level signal interconnect within the co-designed FPP fabric hierarchy.
Architecture IPKnown-good-die, test, health and repair coordination for FPP packages.
Architecture IPCooling and thermal/fluidic architecture within the FPP package platform.
Architecture IPA generation/profile record within the first-principles FPP packaging family.
Architecture IPStart with a chip, a software release or a single IP block.