---
title: DieWeaver integration guide | Garmo Labs
url: https://garmolabs.com/developers/software-ip-4887
description: Garmo Labs chips, software and semiconductor IP.
---

Product integration

# DieWeaver integration guide

Multi-objective constrained placement of dies/tiles/chiplets/accelerators with capability, health, power, latency and failure-domain rules.

Documentation version 1.2.0 · 2026-09-07

## Engineering responsibility

Multi-objective constrained placement of dies/tiles/chiplets/accelerators with capability, health, power, latency and failure-domain rules.

## Integration and deployment

DieWeaver: Multi-objective constrained placement of dies/tiles/chiplets/accelerators with capability, health, power, latency and failure-domain rules. Delivered as CLI / SDK / API. Integrate the selected version at its documented input/output boundary; retain source and configuration identity with each result. Use the executable quickstart and bounded server adapter linked on this page.

## Delivery checklist

Versioned package and dependency lock • Deployment environment and access controls • Input/output schemas and integration examples • Evaluation scope, support and update policy

## Release evidence

Our records show product-specific tests within the 280-test commercial suite, 20,000 randomized cases and HTTP/ASGI/import/install campaigns. Source-bound external exercises are documented.

## Scope and known boundaries

Customer-specific performance, economics and physical effects require customer data and validation. Optional PostgreSQL live integration was not executed in the recorded release.

## Start an evaluation

Use /software/dieweaver to review this exact product and submit a release-specific request. No generic package-install command is published for an unmounted or unverified release.

[Discuss a release-specific integration](https://garmolabs.com/contact)